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新(xin)材料科技(jì)與化學技(jì)術創新
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Dow Electronic Materials Introduces New Metallization and Imaging Products for Printed Circuit Boards

Unique Technology Helps Create Smaller, More Sustainable, Less Expensive Consumer Electronics.

發布(bù)時間:

2025-12-13

Copper Gleam™ HV-101 & HV-606 Electrolytic Copper

Copper Gleam™ HV-101 and HV-606 electrolytic coppers are the latest offerings for panel plating in Vertical-in-Line equipment. They deliver high plating efficiency to improve productivity and reduce cost.

發布(bu)時間:

2025-12-13

Copper Gleam™ HS-200 Electrolytic Copper from Dupont Dow Rhom Hass Company

The Copper Gleam™ HS-200 bath is a full bright acid copper plating process specifically formulated for use in conveyorized plating equipment with insoluble anode. Formulated for high current density plating, the process is capable of producing uniform, bright deposits of high ductility and tensile strength in accelerated plating times.

發布(bù)時間:

2025-12-13

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