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新材料科(kē)技與化學(xue)技術創新(xin)

電鍍中間(jiān)體/水性工(gōng)業塗料/工(gong)業清洗化(hua)學品

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新(xīn)聞資訊

新(xin)材料科技(jì)與化學技(jì)術創新

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CRODATERIC CYAP-LQ-AP是一(yī)種低泡沫(mo)、可生物降(jiang)解的兩性(xing)表面活性(xing)劑，在✊高溫(wen)或者低溫(wēn)酸性或者(zhe)堿性的洗(xi)滌劑中有(you)極好的去(qu)🔞垢性，當在(zài)酸性🏃或者(zhe)堿性的噴(pen)霧罐有泡(pao)沫時，該産(chǎn)品可以很(hěn)快打破泡(pào)沫的堆積(jī)，這一特性(xìng)使該産品(pǐn)廣泛用于(yú)室内、室外(wai)的地毯、硬(yìng)表面🈚清洗(xǐ)領域。

圖片(piàn)名稱

Copper Gleam™ HV-101 & HV-606 Electrolytic Copper

Copper Gleam™ HV-101 and HV-606 electrolytic coppers are the latest offerings for panel plating in Vertical-in-Line equipment. They deliver high plating efficiency to improve productivity and reduce cost.

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Copper Gleam™ HS-200 Electrolytic Copper from Dupont Dow Rhom Hass Company

The Copper Gleam™ HS-200 bath is a full bright acid copper plating process specifically formulated for use in conveyorized plating equipment with insoluble anode. Formulated for high current density plating, the process is capable of producing uniform, bright deposits of high ductility and tensile strength in accelerated plating times.

發布(bu)時間:

2025-12-16

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