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新材料科技與(yǔ)化學技術創新

電(diàn)鍍中間體/水性工(gōng)業塗料/工業清洗(xi)化學品

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新材(cái)料科技與化學技(jì)術創新
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Michelman麥可門 Prohere 201082CX 乙烯(xī)-丙烯酸EAA封閉樹脂(zhī)

Developed for anti-corrosion primers and pre-treatment sealers for metallic, substrates providing excellent adhesion to various metallic substrates like steel, electroplated steel and aluminum. In addition, it provides excellent water resistance, and chemical resistance to acids and many solvents.

Metallization for Flexible Circuits

DuPont’s longstanding expertise in electroless copper plating is an excellent match for the demands of flexible and rigid-flex circuits built with polyimide. As more applications migrate to flexible boards, DuPont is committed to providing solutions that will enable high performance in any design configuration. Our highly conductive copper metallization is compatible with roll-to-roll processing and low-stress for long-term durability.

發布時間(jian):

2025-12-16

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