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新材料科(kē)技與化學技術(shù)創新

電鍍中間(jiān)體/水性工業塗(tú)料/工業清洗化(huà)學品

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新材料科技(jì)與化學技術創(chuàng)新

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Copper Gleam™ HV-101 and HV-606 electrolytic coppers are the latest offerings for panel plating in Vertical-in-Line equipment. They deliver high plating efficiency to improve productivity and reduce cost.

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Copper Gleam™ HS-200 Electrolytic Copper from Dupont Dow Rhom Hass Company

The Copper Gleam™ HS-200 bath is a full bright acid copper plating process specifically formulated for use in conveyorized plating equipment with insoluble anode. Formulated for high current density plating, the process is capable of producing uniform, bright deposits of high ductility and tensile strength in accelerated plating times.

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Circuposit™ 3000-1 from Dupont Dow Rhom Hass Company

Circuposit™ 3000-1 Electroless Copper is a unique, patented process that is widely used by leading PCB fabricators throughout the world. This novel self-accelerating electroless copper eliminates the need for a separate accelerator step, saving space and improving quality and control. The 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.

發布(bu)時間:

2025-12-13

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