The Copper Gleam™ HS-200 bath is a full bright acid copper plating process specifically formulated for use in conveyorized plating equipment with insoluble anode. Formulated for high current density plating, the process is capable of producing uniform, bright deposits of high ductility and tensile strength in accelerated plating times.
Key Benefits:
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High Throwing power at accelerate plating rate
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Bright uniform deposits
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Exceptional physical properties
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Complete analytical control
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